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| No.1674815
| No.1674815
- Chen Technology Co., Ltd. Japan
- Product Categories
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BGA solder ball supply
| Information Name: | BGA solder ball supply |
| Published: | 2006-02-15 |
| Validity: | 90 |
| Specifications: | 0.25-0.76 |
| Quantity: | 0.00 |
| Price Description: | Discuss |
| Detailed Product Description： | The purity and sphericity are very high, for BGA, CSP and other cutting-edge packaging technology and use of micro-welding, auto-correction capability when used with relatively large and may allow placement of the error, unprovoked surface flatness problem. Product sub-containing solder ball and lead-free solder ball, cost-effective, lead-free solder ball through SGS test in line with international standards. |
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Copyright © GuangDong ICP No. 10089450, Chen Technology Co., Ltd. Japan All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility
You are the 5963 visitor
Copyright © GuangDong ICP No. 10089450, Chen Technology Co., Ltd. Japan All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility